Display apparatus

ABSTRACT

A display apparatus includes a substrate including a display area; a first thin film transistor arranged on the display area of the substrate and having a first semiconductor layer including a silicon semiconductor and a first gate electrode insulated from the first semiconductor layer by a first gate insulating layer; a second thin film transistor arranged on the display area of the substrate and having a second semiconductor layer including an oxide semiconductor and a second gate electrode insulated from the second semiconductor layer; and a storage capacitor at least partially overlapping the first thin film transistor and having a lower electrode and an upper electrode, wherein the second semiconductor layer and one of the lower electrode and the upper electrode are arranged on a same layer.

CROSS-REFERENCE TO RELATED APPLICATION

Korean Patent Application No. 10-2018-0029280, filed on Mar. 13, 2018,in the Korean Intellectual Property Office, and entitled: “DisplayApparatus,” is incorporated by reference herein in its entirety.

BACKGROUND 1. Field

One or more embodiments herein relate to a display apparatus, and moreparticularly, to a display apparatus driven by a thin film transistorincluding a silicon semiconductor and a thin film transistor includingan oxide semiconductor.

2. Description of the Related Art

Generally, a display apparatus includes a display device and a drivingcircuit for controlling electrical signals for the display device. Thedriving circuit includes a plurality of thin film transistors (TFTs), astorage capacitor, and a plurality of wires.

Recently, to accurately control luminescence intensities of displaydevices, the number of TFTs for each display device has increased. Asthe result, the display devices require, for example, high integrationdensity, low power consumption, low process cost, short process time,and the like.

SUMMARY

Embodiments are directed to a display apparatus including a substrateincluding a display area; a first thin film transistor arranged on thedisplay area of the substrate, the first thin film transistor having afirst semiconductor layer including a silicon semiconductor and a firstgate electrode insulated from the first semiconductor layer by a firstgate insulating layer; a second thin film transistor arranged on thedisplay area of the substrate, the second thin film transistor having asecond semiconductor layer including an oxide semiconductor and a secondgate electrode insulated from the second semiconductor layer; and astorage capacitor at least partially overlapping the first thin filmtransistor, the storage capacitor having a lower electrode and an upperelectrode. The second semiconductor layer and one of the lower electrodeand the upper electrode may be arranged on a same layer.

The display apparatus may further include a second gate insulating layerarranged between the first gate electrode and the second semiconductorlayer in a horizontal direction. The lower electrode of the storagecapacitor and the first gate electrode of the first thin film transistormay be formed in one same body, and the upper electrode of the storagecapacitor may be arranged on the second gate insulating layer.

The second semiconductor layer of the second thin film transistor mayinclude a second channel area, a second source area, and a second drainarea. The second source area and the second drain area may berespectively arranged at two opposite sides of the second channel area.The upper electrode of the storage capacitor and at least one of thesecond source area and the second drain area may include a samematerial.

The display apparatus may further include a display device driven by thefirst thin film transistor and the second thin film transistor. Thefirst thin film transistor may include a driving thin film transistor tosupply a driving current to the display device.

The display apparatus may further include a first wire in the displayarea. The first wire and the upper electrode of the storage capacitormay be arranged on a same layer, and may include a same material.

The display apparatus may further include a second wire in the displayarea. The second wire and the first gate electrode may be arranged on asame layer and may include a same material.

The display apparatus may further include a second gate insulating layerarranged between the first gate electrode and the second semiconductorlayer in a horizontal direction; and a third gate insulating layerarranged between the second semiconductor layer and the second gateelectrode. The lower electrode of the storage capacitor and the secondsemiconductor layer may be arranged on a same layer. A dielectric layerof the storage capacitor and the third gate insulating layer may beformed of a same material. The upper electrode of the storage capacitorand the second gate electrode of the second thin film transistor may bearranged on a same layer as.

According to one or more embodiments, the display apparatus may includea substrate including a first area, a second area, and a bending areabetween the first area and the second area and bent with respect to abending axis; a first thin film transistor, a second thin filmtransistor, and a storage capacitor arranged in the first area of thesubstrate; a connection wire extending from the first area to the secondarea across the bending area; and an inner wire and an outer wirerespectively connected to the connection wire and spaced apart from eachother by the bending area. The first thin film transistor may have afirst semiconductor layer including a silicon semiconductor and a firstgate electrode insulated from the first semiconductor layer by a firstgate insulating layer. The second thin film transistor may have a secondsemiconductor layer including an oxide semiconductor layer and a secondgate electrode insulated from the second semiconductor layer by a thirdgate electrode. The second semiconductor layer and one of a lowerelectrode and an upper electrode of the storage capacitor may bearranged on a same layer.

The display apparatus may further include a display device driven by thefirst thin film transistor and the second thin film transistor. Thefirst thin film transistor may include a driving thin film transistor tosupply a driving current to the display device.

The storage capacitor may at least partially overlap the first thin filmtransistor in a vertical direction.

The display apparatus may further include a second gate insulating layerarranged between the first gate electrode of the first thin filmtransistor and the second semiconductor layer in a horizontal direction.The lower electrode of the storage capacitor and the first gateelectrode of the first thin film transistor may be formed in one body.The upper electrode of the storage capacitor may be arranged on thesecond gate insulating layer.

Parts of the inner wire and the outer wire may be arranged on a samelayer. The inner wire, the outer wire, and the first gate electrode mayinclude a same material.

Parts of the inner wire and the outer wire may be arranged on a samelayer. The inner wire, the outer wire, and the second gate electrode mayinclude a same material.

The display apparatus may further include a third gate insulating layerbetween the second semiconductor layer and the second gate electrode.The third gate insulating layer may be arranged below the inner wire. Awidth of the third gate insulating layer arranged below the inner wiremay be substantially identical to a width of the inner wire.

The display apparatus may further include an interlayer insulating layerarranged on the substrate and covering the second gate electrode; afirst electrode arranged on the interlayer insulating layer andconnected to the first semiconductor layer; and a planarization layercovering the first electrode.

The display apparatus may further include a connection electrodearranged on the planarization layer and connected to the first electrodevia contact holes defined in the planarization layer. The connectionwire and the connection electrode may include a same material.

The display apparatus may further include an inorganic insulating layerincluding an opening or a groove corresponding to the bending area. Theorganic material layer may fill the opening or the groove of theinorganic insulating layer.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of skill in the art by describingin detail exemplary embodiments with reference to the attached drawingsin which:

FIG. 1 illustrates a top-plan view of a display apparatus according toan embodiment;

FIG. 2 illustrates a cross-sectional view of a part of the displayapparatus according to an embodiment;

FIGS. 3 through 11 illustrate respectively cross-sectional views ofmanufacturing steps of the display apparatus;

FIG. 12 illustrates a cross-sectional view of a part of a displayapparatus according to another embodiment;

FIG. 13 illustrates a cross-sectional view of a part of a displayapparatus according to another embodiment;

FIG. 14 illustrates a cross-sectional view of a part of a displayapparatus according to another embodiment;

FIG. 15 illustrates a perspective view of a part of a display apparatusaccording to another embodiment;

FIG. 16 illustrates a cross-sectional view of a part of a displayapparatus according to another embodiment;

FIG. 17 illustrates a cross-sectional view of a part of a displayapparatus according to another embodiment;

FIG. 18 illustrates a diagram of an equivalent circuit of a pixelincluded in the display apparatus according to an embodiment; and

FIG. 19 illustrates a layout view of positions of a plurality of thinfilm transistors and a storage capacitor arranged in a pixel included inthe display apparatus, according to an embodiment.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey exemplary implementations to those skilled in the art.

In the drawing figures, the dimensions of layers and regions may beexaggerated for clarity of illustration. It will also be understood thatwhen a layer or element is referred to as being “on” another layer orsubstrate, it can be directly on the other layer or substrate, orintervening layers may also be present. Further, it will be understoodthat when a layer is referred to as being “under” another layer, it canbe directly under, and one or more intervening layers may also bepresent. In addition, it will also be understood that when a layer isreferred to as being “between” two layers, it can be the only layerbetween the two layers, or one or more intervening layers may also bepresent. Like reference numerals refer to like elements throughout.

As the present disclosure allows for various changes and numerousembodiments, particular embodiments will be illustrated in the drawingsand described in detail in the written description. The advantages andfeatures of the present disclosure and methods of achieving theadvantages and features will be described more fully with reference tothe accompanying drawings, in which exemplary embodiments of the presentdisclosure are shown. The present disclosure may, however, be embodiedin many different forms and should not be construed as limited to theexemplary embodiments set forth herein.

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings, wherein like referencenumerals refer to like elements throughout, and overlapping descriptionwill be omitted. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items. Expressionssuch as “at least one of,” when preceding a list of elements, modify theentire list of elements and do not modify the individual elements of thelist.

Although the terms “first,” “second” may be used herein to describevarious elements, these elements should not be limited by these terms,and these terms are only used to distinguish one element from another.

The singular forms “a,” “an,” and “the” are intended to include theplural forms as well, unless the context clearly indicates otherwise.

It will be further understood that the terms “comprises” and/or“comprising” used herein specify the presence of the stated features orcomponents, but do not preclude the presence or addition of one or moreother features or components.

Sizes of elements may be exaggerated for convenience of explanation. Inother words, since sizes and thicknesses of elements in the drawings arearbitrarily illustrated for convenience of explanation, the presentdisclosure is not limited thereto.

When a certain embodiment may be implemented differently, a specificprocess order may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

It will be understood that when a layer, region, or element is referredto as being “connected” to another layer, region, or element, it may bedirectly or indirectly connected to the other layer, region, or element.That is, intervening layers, regions, elements may be present. Forexample, when a layer, region, or element is electrically connected toanother layer, region, or element, the layer, region, or element may bedirectly and electrically connected to the other layer, region, orelement, or intervening layers, regions, elements may be present.

FIG. 1 illustrates a top-plan view of a display apparatus according toan embodiment.

In a display area DA of a substrate 110, pixels PXs respectivelyincluding various kinds of display devices, e.g., an organiclight-emitting device (OLED), may be arranged. Various kinds of wiresfor supplying electrical signals to the display area DA may be arrangedin a peripheral area PA of the substrate 110. In other embodiments, thepresent disclosure may be applied to various kinds of displayapparatuses, e.g., a liquid crystal display (LCD), an electrophoreticimage display, an electro luminance display, and the like.

FIG. 2 illustrates a cross-sectional view of a part of the displaydevice of the display apparatus according to an embodiment.

Referring to FIG. 2, a display apparatus 10 according to an embodimentmay include a first thin film transistor T1 including a siliconsemiconductor, a second thin film transistor T2 including an oxidesemiconductor, and a storage capacitor Cst at least partiallyoverlapping the first thin film transistor T1 and including an upperelectrode C2 and a lower electrode C1. Further, a second semiconductorlayer AO2 of the second thin film transistor T2 and one of the upperelectrode C2 and the lower electrode C1 of the storage capacitor Cst maybe arranged on the same layer. For example, as illustrated in FIG. 2,the second semiconductor layer AO2 of the second thin film transistor T2and the upper electrode C2 of the storage capacitor Cst may be arrangedon the same layer. For example, the second semiconductor layer AO2 ofthe second thin film transistor T2 and the lower electrode C of thestorage capacitor Cst may have the same level from the substrate 110.For example, the second semiconductor layer AO2 of the second thin filmtransistor T2 may be at a higher level from the substrate 110 than thefirst semiconductor layer AS1 of the first thin film transistor T1.

The first thin film transistor T1 may include a first semiconductorlayer AS1 including a silicon semiconductor and a first gate electrodeG1 insulated from the first semiconductor layer AS1. The first thin filmtransistor T1 may include a first source electrode SE1 and a first drainelectrode DE connected to the first semiconductor layer AS1. The firstthin film transistor T1 may function as a driving thin film transistorin, e.g., a driving circuit.

The second thin film transistor T2 may include the second semiconductorlayer AO2 including an oxide semiconductor and a second gate electrodeG2 insulated from the second semiconductor layer AO2. The second thinfilm transistor T2 may include a second source electrode SE2 and asecond drain electrode DE2 connected to the second semiconductor layerAO2. The second thin film transistor T2 may function as a switching thinfilm transistor. In other embodiments, the second thin film transistorT2 may be any kind of thin film transistor other than the driving thinfilm transistor in the driving circuit. For example, the firstsemiconductor layer AS1 of the first thin film transistor T1 may becloser to the substrate 110 than the second semiconductor layer AO2 ofthe second thin film transistor T2.

According to an embodiment, the first semiconductor layer AS1 of thefirst thin film transistor T1 (e.g., that functions as the driving thinfilm transistor) may include polycrystalline silicon having highreliability, and the second semiconductor layer AS2 of the second thinfilm transistor T2 (e.g., that functions as the switching thin filmtransistor) may include an oxide semiconductor layer having low leakagecurrent.

For example, when a driving thin film transistor (e.g., that directlyaffects a brightness of the display device) of a display apparatusincludes a semiconductor layer including, e.g., polycrystalline siliconhaving high reliability, the display apparatus may have a highresolution or a high definition due to the high reliability of thedriving thin film transistor.

For example, when a thin film transistor has a semiconductor layerincluding an oxide semiconductor, which has high carrier mobility andlow leakage current, the thin film transistor may not have a greatvoltage drop for a long driving time. In other words, when the thin filmtransistor including the oxide semiconductor may be driven by lowfrequency, the thin film transistor may have a low voltage drop suchthat there are not significant color changes in images due to the lowvoltage drop of the thin film transistor at the low frequency operation.Thus, power consumption of a driving circuit including the thin filmtransistor having a semiconductor layer including the oxidesemiconductor may be lower than power consumption of a driving circuitincluding thin film transistors having a semiconductor layer includingpolycrystalline silicon.

In the embodiments, when at least one of other thin film transistors ofthe display apparatus, except for the driving thin film transistorthereof, includes a semiconductor layer (i.e., an active layer)including an oxide semiconductor, the power consumption of the displayapparatus may be reduced. For example, as the number of thin filmtransistors having semiconductor layers including an oxide semiconductorincreases, the power consumption of the display apparatus may bedecreased.

According to the embodiments, the display apparatus may include thestorage capacitor Cst overlapping the first thin film transistor T1 suchthat the display apparatus may have high integration density. Further,by arranging the second semiconductor layer AO2 and one of the upperelectrode C2 and the lower electrode C1 of the storage capacitor Cst onthe same layer, process time and process cost for the display apparatusmay be reduced.

Hereinafter, referring to FIG. 2, components included in the displayapparatus will be described according to a stack order of the componentson the substrate 110.

The substrate 110 may include, e.g., a glass material, a ceramicmaterial, a metal material, or a flexible or bendable material. Forexample, when the substrate 110 is flexible or bendable, the substrate110 may include a polymer, e.g., polyethersulfone (PES), polyacrylate(PAR), polyetherimide (PEI), polyethylene naphthalate (PEN),polyethylene terephthalate (PET), polyphenylene sulfide (PPS),polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetatepropionate (CAP). For example, the substrate 110 may have a single-layeror a multi-layer structure formed of the aforementioned materials. Whenthe substrate 110 has the multi-layer structure, the substrate 110 mayinclude, e.g., an inorganic material layer. In some embodiment, thesubstrate 110 may have a multi-layer structure that an organic materiallayer, an inorganic material layer, and an organic material layer aresequentially stacked.

A buffer layer 111 may enhance smoothness of an upper surface of thesubstrate 110, and may be formed of an oxide film (e.g., silicon oxide(SiOx)) and/or a nitride film (e.g., silicon nitride (SiNx)).

A barrier layer (not shown) may be further included between thesubstrate 110 and the buffer layer 111. The barrier layer may prevent orminimize impurities from the substrate 1.10, and the like, permeatinginto the first semiconductor layer AS1 of the first thin film transistorT1. The barrier layer may include inorganic materials, e.g., oxides ornitrides, organic materials, or compounds of organic materials andinorganic materials, and may have a single-layer structure or amulti-layer structure including, e.g., inorganic materials and organicmaterials.

The first semiconductor layer AS1 of the first thin film transistor T1including the silicon semiconductor may be arranged on the buffer layer111, and may include a first source area S1 and a first drain area D1separated from each other, and a first channel area A1 arranged betweenthe first source area S1 and the first drain area D1.

The first semiconductor layer AS1 of the first thin film transistor T1may include, e.g., polycrystalline silicon. The first source area S1 andthe first drain area D1 may be doped with impurities, and may haveconductivity. The first source area S and the first drain area D1 of thefirst semiconductor layer AS1 may respectively connected to a firstsource electrode SE1 and a first drain electrode DE1 through a firstcontact hole CNT1 and a second contact hole CNT2. In an embodiment,positions of the first source area S1 and the first drain area D1 of thefirst thin film transistor T1 may be exchanged with each other.

The first gate electrode G1 of the first thin film transistor T1 may bearranged above the first semiconductor layer AS1. A first gateinsulating layer 112 may be arranged between the first semiconductorlayer AS1 and the first gate electrode G1 of the first thin filmtransistor T1.

The first gate insulating layer 112 may include an inorganic materialincluding, e.g., an oxide or a nitride. For example, the first gateinsulating layer 112 may include, e.g., silicon oxide (SiO₂), siliconnitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al₂O₃),titanium oxide (TiO₂), tantalum oxide (Ta₂O₅), hafnium oxide (HfO₂), orzinc oxide (ZnO₂). The first gate electrode G1 of the first thin filmtransistor T1, which overlaps the first channel area A1, may include,e.g., molybdenum (Mo), copper (Cu), and titanium (Ti), and may have asingle-layer structure or a multi-layer structure.

The storage capacitor Cst may overlap the first gate electrode G1 of thefirst thin film transistor T1. The storage capacitor Cst may include thelower electrode C1 and the upper electrode C2. A second gate insulatinglayer 113 may be arranged between the lower electrode C1 and the upperelectrode C2 of the storage capacitor Cst. The first gate electrode G1may function not only as the first gate electrode G1 of the first thinfilm transistor T1 but also as the lower electrode C1 of the storagecapacitor Cst. For example, the first gate electrode G1 of the firstthin film transistor T1 and the lower electrode C1 of the storagecapacitor Cst may be formed in one body. The upper electrode C2 of thestorage capacitor Cst may be arranged on the second gate insulatinglayer 113 to at least partially overlap the lower electrode C1 of thestorage capacitor Cst. The upper electrode C2 of the storage capacitorCst may be electrically connected to a driving voltage line forsupplying a driving voltage. For example, the upper electrode C2 of thestorage capacitor Cst may be formed as a part of a mesh wire crossingthe driving voltage line, and may supply the driving voltage. Forexample, the second gate insulating layer 113 may arranged between thefirst gate electrode G1 of the first thin film transistor T1 and thesecond semiconductor layer AO2 of the second thin film transistor T2 ina horizontal direction parallel to a top surface of the substrate 110.

The second gate insulating layer 113 may include an inorganic materiallayer including, e.g., an oxide or a nitride. For example, the secondgate insulating layer 113 may include, e.g., SiO₂, SiNx, SiON, Al₂O₃,TiO₂, Ta₂O₅, HfO₂, or ZnO₂, and so on.

The second semiconductor layer AO2 of the second thin film transistor T2(e.g., that includes the oxide semiconductor layer and does not overlapthe upper electrode C2 of the storage capacitor Cst in a verticaldirection) may be arranged on the second gate insulating layer 113. Thesecond semiconductor layer AO2 may include a second source area S2 and asecond drain area D2 (e.g., that may have conductivity and may beseparated from each other), and a second channel area A2 arrangedbetween the second source area S2 and the second drain area D2. Thesecond source area S2 and the second drain area D2 may respectively beconnected to a second source electrode SE2 and a second drain electrodeDE2 through a third contact hole CNT3 and a fourth contact hole CNT4. Inan embodiment, positions of the second source area S2 and the seconddrain area D2 of the second thin film transistor T2 may be exchangedwith each other.

The second semiconductor layer AO2 of the second thin film transistor T2may include a ZnO-based material, e.g., ZnO, indium (In)—ZnO, gallium(Ga)—In—ZnO, and so on. In some embodiments, the second semiconductorlayer AO2 may be an In—Ga—ZnO (IGZO) semiconductor including metals,e.g., In and Ga in ZnO.

The second source area S2 and the second drain area D2 of the secondthin film transistor T2 may be formed by a conductivizing process, e.g.,by adjusting carrier concentration of the oxide semiconductor. Forexample, the second source area S2 and the second source drain area D2of the second thin film transistor T2 may be formed by increasing thecarrier concentration of the oxide semiconductor using a plasmatreatment with, e.g., hydrogen-based gases, fluorine-based gases, orcombinations thereof.

The upper electrode C2 of the storage capacitor Cst and the secondsemiconductor layer AO2 may be formed of the same material, and may beformed on the same layer. For example, the upper electrode C2 of thestorage capacitor Cst and at least one of the second source area S2 andthe second drain area D2 of the second thin film transistor T2 mayinclude the same material. In other words, the upper electrode C2 of thestorage capacitor Cst may be formed by a conductivizing process, e.g.,by adjusting carrier concentration of the oxide semiconductor. Forexample, the upper electrode C2 of the storage capacitor Cst may beformed by increasing the carrier concentration of the oxidesemiconductor using a plasma treatment with, e.g., hydrogen-based gases,fluorine-based gases, or combinations thereof.

A first wire W1 may include the same material as the upper electrode C2of the storage capacitor Cst and the second semiconductor layer AO2 ofthe second thin film transistor T2. The first wire W1 may be arranged onthe second gate insulating layer 113. The first wire W1 may supplysignals, e.g., an initialization voltage, to the first thin filmtransistor T1 via the second thin film transistor T2 or another thinfilm transistor (not shown). For example, the first wire W1 and thesecond semiconductor layer AO2 of the second thin film transistor T2 mayhave the same level from the substrate 110.

The first wire W1 and the second semiconductor layer AO2 of the secondthin film transistor T2 may be formed of the same material, and may beformed on the same layer, e.g., the second gate insulating layer 113.For example, the first wire W1 and at least one of the second sourcearea S2 and the second drain area D2 may be formed of the same material.In other words, the first wire W1 may be formed by a conductivizingprocess, e.g., by adjusting carrier concentration of the oxidesemiconductor. For example, the first wire W1 may be formed byincreasing the carrier concentration of the oxide semiconductor using aplasma treatment with, e.g., hydrogen-based gases, fluorine-based gases,or combinations thereof.

The second gate electrode G2 of the second thin film transistor T2 maybe arranged above the second semiconductor layer AO2, and a third gateinsulating layer 115 may be arranged between the second semiconductorlayer AO2 and the second gate electrode G2. The second gate electrode G2of the second thin film transistor T2 may overlap the second channelarea A2, and may be insulated from the second semiconductor layer AO2 bythe third gate insulating layer 115.

As the third gate insulating layer 115 and the second gate electrode G2may be formed by a process using the same mask, a side of the third gateinsulating layer 115 may be arranged on the same plane as a side of thesecond gate electrode G2. In other words, the side of the third gateinsulating layer 115 may be aligned to the side of the second gateelectrode G2 in a vertical direction. For example, in a horizontaldirection, a width of the third gate insulating layer 115 maysubstantially be identical to a width of the second gate electrode G2.

The third gate insulating layer 115 may include an inorganic materialincluding, e.g., an oxide or a nitride. For example, the third gateinsulating layer 115 may include, e.g., SiO₂, SiNx, SiON, Al₂O₃, TiO₂,Ta₂O₅, HfO₂, or ZnO₂, and so on. The second gate electrode G2 may bearranged on the third gate insulating layer 115, and may include, e.g.,Mo, Cu, Ti, and the like. In some embodiments, the second gate electrodeG2 may have a single-layer structure or a multi-layer structure. Thesecond gate electrode G2 may be connected to a scan line for supplyingscan signals to the second thin film transistor T2.

An interlayer insulating layer 116 may be arranged on the second gateelectrode G2, and the first source electrode SE1 and/or the first drainelectrode DE1 connected to the first semiconductor layer AS1 and thesecond electrode SE2 and/or the second drain electrode DE2 connected tothe second semiconductor layer AO2. A data line for supplying a datasignal and a driving voltage line for supplying a driving voltage may bearranged on the interlayer insulating layer 116. The first sourceelectrode SE1, the first drain electrode DE1, the second sourceelectrode SE2, or the second drain electrode DE2 may be connected to thedata line or the driving voltage line directly or via another thin filmtransistor.

The interlayer insulating layer 116 may include an inorganic materialincluding, e.g., an oxide or a nitride. For example, the interlayerinsulating layer 116 may include, e.g., SiO₂, SiNx, SiON, Al₂O₃, TiO₂,Ta₂O₅, HfO₂, or ZnO₂, and the like.

The first source electrode SE1 and/or the first drain electrode DE1, andthe second source electrode SE2 and/or the second drain electrode DE2may include materials having high conductivity, e.g., metals orconductive oxides. For example, the first source electrode SE1 and/orthe first drain electrode DE1 and the second source electrode SE2 and/orthe second drain electrode DE2 may respectively have single-layerstructures or multi-layer structures including, e.g., Al, Cu, Ti, and soon. In some embodiments, the first source electrode SE1 and/or the firstdrain electrode DE1 and the second source electrode SE2 and/or thesecond drain electrode DE2 may respectively have triple-layer structuresincluding, e.g., Ti or Al. For example, each triple-layer structure maybe formed by consecutively stacking Ti, Al, and Ti.

A planarization layer 118 may be arranged on the first source electrodeSE1 and/or the first drain electrode DE1, the second source electrodeSE2 and/or the second drain electrode DE2. The planarization layer 118may include organic materials, e.g., acryl, BCB, PI, or HMDSO. In anembodiment, the planarization layer 118 may include inorganic materials.The planarization layer 118 may function as a protection layer coveringthe first and second thin film transistors T1 and T2, and may have anupper surface that is smoothened. In some embodiment, the planarizationlayer 118 may have a single-layer structure or a multi-layer structure.

An organic light-emitting device OLED may include a pixel electrode 310,an opposite electrode 330, and an intermediate layer 320 that includesan emission layer and is between the pixel electrode 310 and an oppositeelectrode 330. For example, the pixel electrode 310 of the organiclight-emitting device OLED may be arranged on the planarization layer118.

The pixel electrode 310 may be connected to the first drain electrodeDE1 through a contact hole defined in the planarization layer 118, andmay be connected to the first drain area D1 of the first thin filmtransistor T1 via the first drain electrode DE1. The pixel electrode 310may directly be connected to the first thin film transistor T1, or maybe indirectly connected to the first thin film transistor T1 via anotherthin film transistor (not shown) for controlling light-emission of theorganic light-emitting device OLED.

The pixel electrode 310 may be a reflecting electrode including areflection layer. The reflection layer may include at least one of,e.g., silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt),palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir),and chrome (Cr). In some embodiments, the pixel electrode 310 mayinclude a transparent electrode or a semi-transparent electrode on thereflection layer, the transparent electrode or the semi-transparentelectrode may include at least one of, e.g., indium tin oxide (ITO),indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indiumgallium oxide (IGO), and aluminum zinc oxide (AZO).

In an embodiment, the pixel electrode 310 may have a triple-layerstructure including, e.g., ITO or Ag. For example, the triple-layerstructure may be formed by consecutively stacking ITO, Ag, and ITO.

A pixel defining layer 120 may be arranged on the planarization layer118. The pixel defining layer 120 may define pixels by forming anopening corresponding to each sub pixel, e.g., an opening exposing atleast a center area of the pixel electrode 310. The pixel defining layer120 may prevent electric arcs and the like at edges of the pixelelectrode 310, by increasing distances between the edges of the pixelelectrode 310 and the opposite electrode 330 above the pixel electrode310. The pixel defining layer 120 may include an organic material, e.g.,PI or HMDSO, and so on.

The intermediate layer 320 of the organic light-emitting device OLED mayinclude, e.g., a low molecular weight material or a high molecularweight material. When the intermediate layer 320 includes the lowmolecular weight material, the intermediate layer 320 may have a holeinjection layer (HIL), a hole transport layer (HTL), an emission layer(EML), an electron transport layer (ETL), and an electron injectionlayer (EIL), or the like, and may have a single-layer structure or amulti-layer structure. The low molecular weight material may includevarious organic materials, e.g., copper phthalocyanine (CuPc),N,N′-Di(Naphthalene-1-yl)-N,N′-diphenyl-benzidine (NPB),tris-8-hydroxyquinoline aluminum (Alq3), and so on. The various organicmaterials may be formed by a vacuum deposition method.

When the intermediate layer 320 includes the high molecular weightmaterial, the intermediate layer 320 may have a structure including,e.g., an HTL and an EML. For example, the HTL may include, e.g.,Poly(3,4-ethylenedioxythiophene (PEDOT), and the emission layer mayinclude polymer materials like poly-phenylenevinylene (PPV) andpolyfluorene, and so on. The intermediate layer 320 may be formed by,e.g., a screen printing method, an inkjet printing method, a laserinduced thermal imaging (LITI) method, and so on.

In some embodiments, the intermediate layer 320 may have many differentstructures. For example, the intermediate layer 320 may include aone-body layer corresponding to a plurality of pixel electrodes. Forexample, the intermediate layer 320 may have pattern layerscorresponding to each of the plurality of pixel electrodes.

The opposite electrode 330 of the organic light-emitting device OLED maybe formed in a one-body type with respect to a plurality of organiclight-emitting devices to correspond to the plurality of pixelelectrodes 310. The opposite electrode 330 may be a transparentelectrode or a semi-transparent electrode. For example, the oppositeelectrode 330 may include at least one of, e.g., Al, Mg, Li, Ca, Cu,LiF/Ca, LiF/Al, MgAg, and CaAg, and may be formed as a thin film havinga thickness of, e.g., about a few nm to about dozens of nm.

As the organic light-emitting device OLED may be easily damaged due tomoisture or oxygen permeating from outside, a thin film encapsulationlayer (not shown) may encapsulate the organic light-emitting device OLEDfor protection. The thin film encapsulation layer (not shown) may coverthe display area DA, and may extend to an outer circumference of thedisplay area DA. The thin film encapsulation layer may include aninorganic encapsulation layer including at least one inorganic materialand an organic layer including at least one organic material. In someembodiments, the thin film encapsulation layer may have a stackstructure of a first inorganic encapsulation layer, an organicencapsulation layer, and a second inorganic encapsulation layer.

For example, a spacer for protecting a mask from being chipped may beformed on the pixel defining layer 120, and various functional layers,e.g., a polarizing layer for decreasing reflection of external light, ablack matrix, a color filter, and/or a touch screen including a touchelectrode, and the like, may be provided on the thin film encapsulationlayer.

FIGS. 3 through 11 illustrate respectively cross-sectional views ofmanufacturing steps of the display apparatus of FIG. 2. Steps shown inFIGS. 3 through 11 may be performed on the substrate 110 arranged on acarrier substrate (not shown), and the carrier substrate may be removedafter performing the step shown in FIG. 11.

Referring to FIG. 3, the buffer layer 111 and a polycrystalline siliconlayer AS1′ are formed on the substrate 110. The buffer layer 111 mayinclude inorganic materials, e.g., silicon oxide, silicon nitride and/orsilicon oxynitride, and the like, and may have a single-layer structureor a multi-layer structure.

The polycrystalline silicon layer AS1′ may be formed through formingamorphous silicon on the entire surface of the substrate 110, formingpolycrystalline silicon by annealing the amorphous silicon, andpatterning the polycrystalline silicon with a first mask (not shown). Inan embodiment, the polycrystalline silicon layer AS1′ may be formedthrough forming the polycrystalline silicon directly on the entiresurface of the substrate 110 and patterning the polycrystalline silicon.

Referring to FIG. 4, the first gate insulating layer 112 may be formedon the buffer layer 111 to cover the polycrystalline silicon layer AS1′,and then the first gate electrode G1 may be formed on the first gateinsulating layer 112.

The first gate electrode G1 may be formed by coating a conductivematerial on the first gate insulating layer 112 and patterning theconductive material with a second mask (not shown). For example, theconductive material may include, e.g., Mo, Cu, and/or Ti.

After formation of the first gate electrode G1, a first source area S1and a first drain area D1 may be formed by doping with impurities suchthat the first source area S1 and the first drain area D may haveconductivity. For example, the first source area S1 and the first drainarea D1 may be formed by doping the polycrystalline silicon layer AS1′with impurities using the first gate electrode G1 as a blocking member.In other words, in this step, the polycrystalline silicon layer AS1′ maybe changed into the first semiconductor layer AS1 including the firstsource area S1, the first drain area D1, and the first channel area A1not doped with impurities.

Referring to FIG. 5, after forming the second gate insulating layer 113on the first gate insulating layer 112 to cover the first gate electrodeG1, a pre-second semiconductor layer AO2′ including an oxidesemiconductor, a pre-upper electrode C2′, and a pre-first wire W1′ maybe formed on the second gate insulating layer 113.

According to an embodiment, the pre-second semiconductor layer AO2′, thepre-upper electrode C2′, and the pre-first wire W1′ may be formed byapplying (or depositing) the oxide semiconductor on the second gateinsulating layer 113 and patterning the oxide semiconductor with a thirdmask (not shown).

The oxide semiconductor layer may include, e.g., a ZnO-based material,e.g., ZnO, In—ZnO, Ga—In—ZnO, and so on. In some embodiment, the oxidesemiconductor may be an In—Ga—ZnO (IGZO) semiconductor including metals,e.g., In and Ga in ZnO.

Referring to FIG. 6, the third gate insulating layer 115 and the secondgate electrode G2 may be formed on the pre-second semiconductor layerAO2′. The third gate insulating layer 115 and the second gate electrodeG2 may be formed by consecutively applying (or depositing) an insulatingmaterial and a conductive material on the second gate insulating layer113 and simultaneously patterning the insulating and conductivematerials with a fourth mask (not shown). As the third gate insulatinglayer 115 and the second gate electrode G2 are simultaneously formedwith the same mask, the third gate insulating layer 115 and the secondgate electrode G2 may have the substantially same width.

Referring to FIG. 7, the second source area S2, the second drain areaD2, the upper electrode C2, and the first wire W1 are formed by aconductivizing process, e.g., by increasing carrier concentration of apart of the pre-second semiconductor layer AO2′, the pre-upper electrodeC2′, and the pre-first wire W1′. For example, as the second gateelectrode G2 may be used as a blocking member, the second channel areaA2 of the second semiconductor layer AO2 may not be conductivized, andmay maintain a characteristic of a semiconductor.

In some embodiments, the conductivizing process may be performed using aplasma treatment. The plasma treatment may be performed by using, e.g.,hydrogen-based gases, fluorine-based gases, or combinations thereof.

In the conductivizing process, a hydrogen gas may permeate in adirection of a thickness of the oxide semiconductor and increase aconcentration of a carrier such that a surface resistance of the oxidesemiconductor may decrease. For example, the plasma treatment using thehydrogen gas may reduce an oxide metal in the oxide semiconductor byremoving oxygen of the oxide metal such that the surface resistance ofthe oxide semiconductor may be reduced.

In some embodiment, when the plasma treatment is performed by using afluorine-based gas, a fluorine component may increase and an oxygencomponent may decrease on the surface of the oxide semiconductor, andthus, an additional carrier may be formed on the surface of the oxidesemiconductor. Accordingly, the carrier concentration of the oxidesemiconductor may increase and the surface resistance of the oxidesemiconductor may decrease. For example, the fluorine-based gas may be,e.g., CF₄, C₄F₈, NF₃, SF₆, or combinations thereof.

In another embodiment, the plasma treatment may be performed by anitrogen gas. During the plasma treatment by using the nitrogen gas, anannealing process may be simultaneously performed. For example, theannealing process may be performed from about 1 hour to about 2 hours ata temperature from about 300° C. to about 400° C.

By the plasma treatment, the carrier concentration of the oxidesemiconductor may be adjusted from a range of about 1.0 E+14 to about1.0 E+18 cm⁻³ to a value equal to or greater than 1.0 E+19 cm⁻³.

Next, the first contact hole CNT1 and/or the second contact hole CNT2may respectively expose the first source area S1 and/or the first drainarea D1 of the first semiconductor layer AS1, and may be formed byforming the interlayer insulating layer 116 to cover the secondsemiconductor layer AO2, the upper electrode C2, and the first wire W1,and then by simultaneously removing (or penetrating) parts of theinterlayer insulating layer 116, the second gate insulating layer 113,and the first gate insulating layer 112, with a fifth mask (not shown).

After forming the first contact hole CNT1 and/or the second contact holeCNT2, the annealing process may be performed. The annealing process maybe a process for increasing carrier mobility of the first semiconductorlayer AS1 by heating the first semiconductor layer AS1.

During the annealing process, an oxide layer may be formed on a surfaceof the first source area S1 exposed through the first contact hole CNT1and/or the first drain area D exposed through the second contact holeCNT2. To remove the oxide layer, a washing process may be performedafter the annealing process. For example, a buffered oxide etchant (BOE)may be used as a detergent for the washing process.

Although the BEO may etch an oxide semiconductor, the secondsemiconductor layer AO2 including the oxide semiconductor may beprotected from the BEO by the interlayer insulating layer 116 when thefirst contact hole CNT1 and/or the second contact hole CNT2 are formed,

Referring to FIG. 8, by etching the interlayer insulating layer 116 witha sixth mask (not shown) process, the third contact hole CNT3 and/or thefourth contact hole CNT4 may respectively expose the second source areaS2 and/or the second drain area D2 of the second semiconductor layerAO2.

Referring to FIG. 9, the first source electrode SE1, the first drainelectrode DE1, the second source electrode SE2, and the second drainelectrode DE2 may be formed on the interlayer insulating layer 116. Thefirst source electrode SE1, the first drain electrode DE1, the secondsource electrode SE2, and the second drain electrode DE2 may besimultaneously formed by patterning the conductive material with aseventh mask (not shown) after forming the conductive material on theinterlayer insulating layer 116. In other words, the first sourceelectrode SE1, the first drain electrode DE1, the second sourceelectrode SE2, and the second drain electrode DE2 may be arranged on onesame layer, and may include same materials. For example, each of thefirst source electrode SE1, the first drain electrode DE1, the secondsource electrode SE2, and the second drain electrode DE2 may have atriple-layer structure including, e.g., Ti or Al. For example, thetriple-layer structure may be formed by consecutively stacking Ti, Al,and Ti.

The first source electrode SE1 may fill the first contact hole CNT1 andcontact the first source area S1 of the first semiconductor layer AS1through the first contact hole CNT1. The first drain electrode DE1 mayfill the second contact hole CNT2, and may contact the first drain areaD1 of the first semiconductor layer AS1 through the second contact holeCNT2.

The second source electrode SE2 may fill the third contact hole CNT3,and may contact the second source area S2 of the second semiconductorlayer AO2 through the third contact hole CNT3. The second drainelectrode DE2 may fill the fourth contact hole CNT4, and may contact thesecond drain area D2 of the second semiconductor layer AO2 through thefourth contact hole CNT4.

Referring to FIG. 10, the planarization layer 118 may formed on theinterlayer insulating layer 116 to cover the first source electrode SE1,the first drain electrode DE1, the second source electrode SE2, and thesecond drain electrode DE2. The planarization layer 118 may include avia hole VIA exposing the first drain electrode DE1. The planarizationlayer 118 may be formed by forming an organic material to cover thefirst source electrode SE1, the first drain electrode DE1, the secondsource electrode SE2, and the second drain electrode DE2, and patterningthe via hole VIA with an eighth mask (not shown). For example, theorganic material may include, e.g., acryl, benzocyclobutene (BCB), PI,or HMDSO, and the like.

Referring to FIG. 11, after forming a pixel electrode 310 on theplanarization layer 118 with a ninth mask (not shown), a pixel defininglayer 120 may be formed on the planarization layer 118 and the pixelelectrode 310 with a tenth mask (not shown). For example, the pixeldefining layer 120 may have an opening exposing a part of the pixelelectrode 310.

The pixel electrode 310 may fill the via hole VIA, and may contact thefirst drain electrode DE1 through the via hole VIA. In some embodiment,a connection area of the pixel electrode 310, in which the first drainelectrode DE1 and the pixel electrode 310 are connected to each other,may not be on the first thin film transistor T1. For example, the firstthin film transistor T1 and the pixel electrode 310 may be connected toeach other via another thin film transistor, and the connection area ofthe pixel electrode 310 may be arranged on the another thin filmtransistor.

Next, an organic light-emitting device OLED may be formed by forming theintermediate layer 320 including an organic emission layer on the pixelelectrode 310 and forming the opposite electrode 330 on the intermediatelayer 320.

FIG. 12 illustrates a cross-sectional view of a part of a displayapparatus 20 according to another embodiment.

Referring to FIG. 12, the display apparatus 20 may include the firstthin film transistor T1 including the silicon semiconductor, the secondthin film transistor T2 including the oxide semiconductor, and thestorage capacitor Cst at least partially overlapping the first thin filmtransistor T1. The upper electrode C2 of the storage capacitor Cst andthe second semiconductor layer AO2 of the second thin film transistor T2may include the same material, and may be formed on the same layer.

The storage capacitor Cst may include the lower electrode C1, the upperelectrode C2, and the second gate insulating layer 113 between the lowerelectrode C1 and the upper electrode C2. The lower electrode C1 of thestorage capacitor Cst and the first gate electrode G1 of the first thinfilm transistor T1 may be formed in one same body. For example, thefirst gate electrode G1 may function not only as a gate electrode of thefirst thin film transistor T1 but also as the lower electrode C1 of thestorage capacitor Cst.

In the embodiment, the display apparatus 20 may include a second wireW2. The second wire W2 and the first gate electrode G1 of the first thinfilm transistor T1 may be formed on the same layer, and may be formed ofthe same material. For example, the second wire W2 may be arranged onthe first gate insulating layer 112, and may include, e.g., Mo, Cu,and/or Ti. The second wire W2 may supply signals, e.g., aninitialization voltage, to the first thin film transistor T1 via thesecond thin film transistor T2 or another thin film transistor (notshown).

FIG. 13 illustrates a cross-sectional view of a part of a displayapparatus 30 according to another embodiment.

Referring to FIG. 13, the display apparatus 30 may include the firstthin film transistor T1 including the silicon semiconductor, the secondthin film transistor T2 including the oxide semiconductor, and thestorage capacitor Cst at least partially overlapping the first thin filmtransistor T1. In FIG. 13, a lower electrode C1″ of the storagecapacitor Cst and the second semiconductor layer AO2 of the second thinfilm transistor T2 may be formed of the same material, and may be formedon the same layer.

The storage capacitor Cst may include the lower electrode C1″ and anupper electrode C2″, and a dielectric layer 115′ between the lowerelectrode C1″ and the upper electrode C2″. The lower electrode C1″ andthe second semiconductor layer AO2 of the second thin film transistor T2may be simultaneously formed. For example, the lower electrode C1″ mayinclude an oxide semiconductor material, and may be conductivized byincreasing carrier concentration through a plasma treatment and thelike. For example, the lower electrode C1″ may include a ZnO-basedmaterial including, e.g., ZnO, In—ZnO, Ga—In—ZnO, and may be formed byincreasing the carrier concentration of the oxide semiconductor layerthrough the plasma treatment by using, e.g., hydrogen-based gases,fluorine-based gases, or combinations thereof.

The upper electrode C2″ and the second gate electrode G2 of the secondthin film transistor T2 may be formed of the same material, and may beformed on the same layer. The dielectric layer 115″ and the third gateinsulating layer 115 may be formed of the same material, and may havedifferent levels from the substrate 110. As the upper electrode C2″ andthe dielectric layer 115″ may be formed in the same mask process, widthsof the upper electrode C2″ and the dielectric layer 115″ maysubstantially be identical to each other.

In the embodiment, as the lower electrode C1″ of the storage capacitorCst and the second semiconductor layer AO2 of the second thin filmtransistor T2 may be formed in the same process, process time andprocess cost for the display apparatus 30 may be reduced.

FIG. 14 illustrates a cross-sectional view of a part of a displayapparatus 40 according to another embodiment.

Referring to FIG. 14, the display apparatus 40 may include the firstthin film transistor T1 including the silicon semiconductor, the secondthin film transistor T2 including the oxide semiconductor, and thestorage capacitor Cst at least partially overlapping the first thin filmtransistor T1. The upper electrode C2 of the storage capacitor Cst andthe second semiconductor layer AO2 of the second thin film transistor T2may include the same material, and may be formed on the same layer.

The storage capacitor Cst may include the lower electrode C1 and theupper electrode C2, and the second gate insulating layer 113 between thelower electrode C1 and the upper electrode C2. The lower electrode C1and the first gate electrode G1 may be formed in one same body. Forexample, the first gate electrode G1 may function not only as the gateelectrode G1 of the first thin film transistor T1 but also as the lowerelectrode C1 of the storage capacitor Cst.

In the embodiment, the display apparatus 40 may include a connectionelectrode CM and/or a third wire W3 on the planarization layer 118, andmay include an upper planarization layer 119 covering the connectionelectrode CM and/or the third wire W3.

The third wire W3 may function as a driving voltage line for supplying adriving voltage or a data line for supplying a data signal. Theconnection electrode CM may be connected to the first drain electrodeDE1 through a contact hole defined in the planarization layer 118. Thethird wire W3 and the connection electrode CM may include, e.g., metalsand conductive materials. For example, each of the third wire W3 and theconnection electrode CM may include, e.g., Al, Cu, and Ti, and may havea single-layer structure or a multi-layer structure. By including thethird wire W3, data signals or driving voltages may be supplied throughvarious routes, and interruptions between the wires may be minimized.

The upper planarization layer 119 may cover the third wire W3 and theconnection electrode CM. The upper planarization layer 119 may includeorganic materials, e.g., acryl, BCB, PI, or HMDSO. An upper surface ofthe upper planarization layer 119 may be smoothened. The upperplanarization layer 119 may have a single-layer structure or amulti-layer structure. The organic light-emitting device OLED mayinclude the pixel electrode 310, the opposite electrode 330, and theintermediate layer 320 that includes the emission layer and is betweenthe pixel electrode 310 and the opposite electrode 330. The organiclight-emitting device OLED may be placed on the upper planarizationlayer 119. The pixel electrode 310 may contact the connection electrodeCM through a via hole in the upper planarization layer 119.

According to the embodiment, an eleventh mask process for patterning theconnection electrode CM and the third wire W3 and a twelfth mask processfor patterning the upper planarization layer 119 including the via holemay be performed.

FIG. 15 illustrates a perspective view of a part of a display apparatusaccording to an embodiment. In the display apparatus according toembodiments, a part of the substrate 110 included in the displayapparatus may be bent, and a part of the display apparatus may be bentlike the substrate 110. However, for convenience of illustration, FIGS.16 and 17 illustrate the display apparatus in an unbent state (i.e., ina flat state).

As shown in FIG. 15, the substrate 110 included in the display apparatusaccording to the embodiment may have a bending area BA extending in afirst direction (i.e., y-direction). With respect to a second direction(i.e., x-direction) crossing the first direction, the bending area BAmay be between a first area 1A and a second area 2A. For example, thesubstrate 110 may be bent with respect to a bending axis BAX extendingin the first direction (i.e., y-direction), as shown in FIG. 1. Forexample, as illustrated in FIG. 15, the substrate 110 may be bent with aregular radius of curvature with respect to the bending axis BAX at acenter of the curvature. In another embodiment, the substrate 110 may bebent in an irregular radius of curvature with respect to the bendingaxis BAX at a center of the curvature.

FIG. 16 illustrates a display apparatus including a bending areaaccording to embodiments. For example, as illustrated in FIG. 16, thedisplay area DA of a display apparatus 50 may have the same structure asthe display apparatus 40 in FIG. 14. In other embodiments, the displayarea DA may have the same structure as those of the display apparatus10, 20, and 30 described above.

A first area 1A may include the display area DA and a part of anon-display area NDA outside the display area DA. A second area 2A mayinclude another part of the non-display area NDA.

A bending area BA may be arranged between the first area 1A and thesecond area 2A. An organic material layer 160 may be arranged in thebending area BA. An inorganic insulating layer 125 including, e.g., thebuffer layer 111, the first gate insulating layer 112, the second gateinsulating layer 113, and the interlayer insulating layer 116, whichrespectively include inorganic materials, may not be arranged in the thebending area BA. For example, as illustrated in FIG. 16, the inorganicinsulating layer 125 may have an opening OP corresponding to the bendingarea BA. In other words, the buffer layer 111, the first gate insulatinglayer 112, the second gate insulating layer 113, and the interlayerinsulating layer 116 may have openings corresponding to the bending areaBA. The opening OP of the inorganic insulating layer 125 correspondingto the bending area BA may overlap the bending area BA. For example, awidth of the opening OP of the inorganic insulating layer 125 may bewider than that of the bending area BA.

For example, as illustrated in FIG. 16, an inner side of an opening 111a of the buffer layer 111 may be identical to an inner side of anopening 112 a of the first gate insulating layer 112. In otherembodiments, a width of the opening 112 a of the first gate insulatinglayer 112 may be greater than a width of the opening 111 a of the bufferlayer 111.

For example, the opening 112 a of the first gate insulating layer 112,an opening 113 a of the second gate insulating layer 113, an opening 116a of the interlayer insulating layer 116 may be simultaneously formedwhen the first contact hole CNT1 and the second contact hole CNT2 areformed. After simultaneously forming the opening 112 a of the first gateinsulating layer 112, an opening 113 a of the second gate insulatinglayer 113, an opening 116 a of the interlayer insulating layer 116, thefirst source electrode SE1 and the first drain electrode DE1 may berespectively formed in the first contact hole CNT1 and the secondcontact hole CNT2. The opening OP of the inorganic insulating layer 125may be formed in an additional mask process for forming the opening 111a of the buffer layer 111 after forming the first source electrode SE1and the first drain electrode DE1. Thus, in the embodiment, thirteenmask processes may be performed.

In some embodiments, to correspond to the bending area BA, a groove,instead of the opening OP, may be formed in the inorganic insulatinglayer 125. For example, the groove corresponding to the bending area BAmay penetrate the first gate insulating layer 112, the second gateinsulating layer 113, and the interlayer insulating layer 116, and maynot penetrate the buffer layer 111. In another embodiment, the groovecorresponding the bending area BA may not penetrate at least one of thefirst gate insulating layer 112, the second gate insulating layer 113,the interlayer insulating layer 116, and the buffer layer 111 such thatthe substrate 110 may not be exposed.

The display apparatus 50 may include the organic material layer 160filling the opening OP or the groove of the inorganic insulating layer125. For example, the organic material layer 160 may overlap the bendingarea BA. The organic material layer 160 may extend to a part of anon-bending area outside the bending area BA. For example, a width ofthe organic material layer 160 may be greater than a width of thebending area BA. Further, a lower surface, e.g., a surface facing thesubstrate 110, of the organic material layer 160 may be narrower than anupper surface of the organic material layer 160. In other words,sidewalls of the opening OP may form an obtuse angle θ with the uppersurface of the substrate 110. The organic material layer 160 may have anirregular thickness. For example, the organic material layer 160 mayhave a greatest thickness in a middle portion thereof, and a smallestthickness at edges thereof. In an embodiment, the organic material layer160 may have a uniform thickness.

The organic material layer 160 may include at least one of, e.g., acryl,methacryl, polyester, polyethylene, polypropylene, PET, PEN, PC, PI,polyethylene sulfonate, polyoxymethylene, polyarylate, and HMDSO. Theorganic material layer 160 and the planarization layer 118 of thedisplay area DA may be simultaneously formed of the same material. In anembodiment, the organic material layer 160 and the planarization layer118 of the display area DA may be formed of different materials atdifferent times. The organic material layer 160 may be variouslymodified. For example, the organic material layer 160 and the upperplanarization layer 119 or the pixel defining layer 120 may besimultaneously formed of the same material.

The display apparatus 50 may include a connection wire 215. Theconnection wire 215 may extend from the first area 1A to the second area2A via the bending area BA, and may be placed on the organic materiallayer 160. For example, the connection wire 215 may be provided on theinorganic insulating layer 125 including the interlayer insulating layer116 in an area in which the organic material layer 160 is not arranged.The connection wire 215 may function as a wire for supplying electricalsignals to the display area DA. The connection wire 215 and theconnection electrode CM may be formed at the same time, and may beformed of the same material.

As described above, although FIG. 16 illustrates the display apparatusin the unbent state (i.e., in a flat state), the display apparatusaccording to the embodiment may be in a state in which the substrate110, or the like, is bent in the bending area BA, as shown in FIG. 15.In other words, when the display apparatus is manufactured, thesubstrate 110 may have a substantially flat state, as shown in FIG. 16,and then, the substrate 110, and so on, may be bent in the bending areaBA such that the display apparatus may have the substantially same formas shown in FIG. 15. Although tension stress may be applied to theconnection wire 215 when the substrate 110, and the like, is bent in thebending area BA, defects of the connection wire 215 on the organicmaterial layer 160 in the bending state may be prevented or minimizeddue to flexibility of the organic material layer 160.

When the inorganic insulating layer 125 does not include the opening OPor the groove in the bending area and has a continuous form from thefirst area 1A to the second area 2A (i.e., when the connection wire 215is placed on the inorganic insulating layer 125), great tension stressmay be applied to the connection wire 215 by the bending operation ofthe substrate 100, and the like. For example, as the inorganicinsulating layer 125 has a rigidity higher than that of the organicmaterial layer 160, probability of cracks of the inorganic insulatinglayer 125 is high in the bending area BA. When the cracks occur in theinorganic insulating layer 125, the cracks of the inorganic insulatinglayer 125 may damage the connection wire 215 on the inorganic insulatinglayer 125, and thus, probability of defects of the connection wire 215,e.g., disconnection, may be increased.

However, as described above, when the inorganic insulating layer 125 mayinclude the opening OP in the bending area BA, and the connection wire215 may be placed on the organic material layer 160 filling the openingOP, the probability of cracks of the inorganic insulating layer 125 maybe significantly decreased, because the inorganic insulating layer 125having a high probability of cracks may not be in the bending area BA.Further, probability of cracks of the organic material layer 160, whichincludes an organic material, may not be high due to a low rigiditythereof. Thus, cracks, and the like, being formed in the connection wire215 on the organic material layer 160 may be prevented or minimized.

The display apparatus 50 according to the embodiment may further includean inner wire 213 i and an outer wire 213 o connected to the connectionwire 215. The inner wire 213 i and the outer wire 213 o are placed inthe first area 1A or the second area 2A on a layer other than that ofthe connection wire 215, and may be electrically connected to theconnection wire 215. For example, the inner wire 213 i and the outerwire 213 o may be formed on the first gate insulating layer 112.

Referring to FIG. 16, the inner wire 213 i may be placed in the firstarea 1A, and the outer wire 213 o may be placed in the second area 2A.The inner wire 213 i and the outer wire 213 o may be formed of the samematerial. The inner wire 213 i, the outer wire 213 o, and the first gateelectrode G1 may be formed on the same layer. For example, the innerwire 213 i, the outer wire 213 o, and the first gate electrode G1 may beformed on the first gate insulating layer 112.

The connection wire 215 may be connected to the inner wire 213 i and theouter wire 213 o through a fifth contact hole CNT5 and a sixth contacthole CNT6 penetrating the interlayer insulating layer 116 and the secondgate insulating layer 113.

The inner wire 213 i in the first area 1A may be electrically connectedto the first thin film transistor T1, the second thin film transistorT2, and the like in the display area DA. For example, the connectionwire 215 may be electrically connected to the first thin film transistorT1, the second thin film transistor T2, and/or the first wire W1, andthe like in the display area DA through the inner wire 213 i. The innerwire 213 i may be connected to conductive layers formed on a differentlayer in the display area DA, e.g., a conductive layer formed on theinterlayer insulating layer 116 or a conductive layer formed on thesecond gate insulating layer 113 through contact holes.

By using the connection wire 215, the outer wire 213 o in the secondarea 2A may be electrically connected to the first thin film transistorT1, the second thin film transistor T2, and/or the first wire W1 in thedisplay area DA. The outer wire 213 o may be connected to conductivelayers formed on different layers in the second area 2A, e.g., theconductive layer placed on the interlayer insulating layer 116 or theconductive layer placed on the second gate insulating layer 113 throughcontact holes.

As described above, the inner wire 213 i and the outer wire 2130 may beelectrically connected to elements in the display area DA while beingplaced outside the display area DA. For example, the inner wire 213 iand the outer wire 213 o may extend toward the display area DA, whilebeing placed outside the display area DA, and may be at least partiallyplaced in the display area DA.

Although the connection wire 215 may cross the bending area BA, cracksor disconnections of the connection wire 215 in the bending area BA maybe prevented or minimized, because the connection wire 215 may have amaterial having a high elongation percentage. When the inner wire 213 iand the outer wire 213 o are used for supplying electric signals in thefirst area 1A and the second area 2A, efficiency of the displayapparatus in supplying electrical signals may be increased or error ratein the manufacturing processes may be decreased, because the inner wire213 i and the outer wire 213 o may have a material having a lowerelongation percentage than that of the connection wire 215 andelectrical/physical features different from those of the connection wire215.

For example, the inner wire 213 i and the outer wire 213 o may include,e.g., Mo, and the connection wire 215 may include, e.g., Al. Theconnection wire 215, the inner wire 213 i, and the outer wire 213 o mayrespectively have multi-layer structures. Meanwhile, ends of the outerwire 213 o in the second area 2A may be exposed outwards, and may beelectrically connected to various electronic devices or a printedcircuit board.

The inorganic insulating layer 125, which is arranged between theconnection wire 215 and the inner wire 213 i and between the connectionwire 215 and the outer wire 2130, may be variously modified ortransformed. For example, only the interlayer insulating layer 116 maybe between the connection wire 215 and the inner wire 213 i and betweenthe connection wire 215 and the outer wire 213 o. In another embodiment,only the interlayer insulating layer 116 may be between the connectionwire 215 and the inner wire 213 i, and the interlayer insulating layer116 and the second gate insulating layer 113 may be between theconnection wire 215 and the outer wire 213 o.

FIG. 17 illustrates a cross-sectional view of a part of a displayapparatus 60 according to another embodiment.

Referring to FIG. 17, the display apparatus 60 may include the bendingarea BA between the first area 1A and the second area 2A. The first area1A may include the first thin film transistor T1 including the siliconsemiconductor, the second thin film transistor T2 including the oxidesemiconductor, and the storage capacitor Cst overlapping the first thinfilm transistor T1. For example, the second semiconductor layer AO2 ofthe second thin film transistor T2 and one of the electrodes of thestorage capacitor Cst may be arranged on the same layer, e.g., on thefirst gate insulating layer 112.

The inorganic insulating layer 125 may include an opening OP or a grooveto correspond to the bending area BA. The organic material layer 160 mayfill the opening OP or the groove. The connection wire 215 may bearranged on the organic material layer 160. The connection wire 215 mayextend from the first area 1A to the second area 2A.

The connection wire 215 may be connected to the inner wire 213 i and theouter wire 213 o through a contact hole CNT5′ and a contact hole CNT6′penetrating the interlayer insulating layer 116.

The inner wire 213 i may be placed in the first area 1A. The outer wire213 o may be placed in the second area 2A. The inner wire 213 i, theouter wire 213 o, and the second gate electrode G2 may be formed of thesame material, and may be on the same layer. For example, the inner wire213 i, the outer wire 213 o, and the second gate electrode G2 may beplaced on the third gate insulating layer 115. For example, as the innerwire 213 i and the third gate insulating layer 115 may be formed withthe same mask process, a width of the inner wire 213 i may substantiallybe identical to a width of the third gate insulating layer 115 arrangedbelow the inner wire 213 i, and a width of the outer wire 213 o maysubstantially be identical to the width of the third gate insulatinglayer 115 arranged below the outer wire 213 o.

The inner wire 213 i in the first area 1A may be electrically connectedto the first thin film transistor T1, the second thin film transistorT2, and the like in the display area DA. The connection wire 215 may beelectrically connected to the first thin film transistor T1, the secondthin film transistor T2, and/or the first wire W1, and the like in thedisplay area DA through the inner wire 213 i. Through a contact hole,the inner wire 213 i may be connected to conductive layers formed on adifferent layer in the display area DA, e.g., a conductive layer formedon the interlayer insulating layer 116 or a conductive layer formed onthe second gate insulating layer 113.

By using the connection wire 215, the outer wire 213 o in the secondarea 2A may be electrically connected to the first thin film transistorT1, the second thin film transistor T2, and/or the first wire W1 in thedisplay area DA. Through a contact hole, the outer wire 213 o may beconnected to conductive layers formed on different layers in the secondarea 2A, e.g., the conductive layer placed on the interlayer insulatinglayer 116 or the conductive layer placed on the second gate insulatinglayer 113.

As described above, the inner wire 213 i and the outer wire 213 o may beelectrically connected to elements in the display area DA while beingplaced outside the display area DA. For example, the inner wire 213 iand the outer wire 213 o may extend toward the display area DA, whilebeing placed outside the display area DA, and may be at least partiallyplaced in the display area DA.

As illustrated in FIG. 17, the inner wire 213 i, the outer wire 213 o,and the second gate electrode G2 may be formed of the same material, andmay be on the same layer. In another embodiment, the inner wire 213 iand the first gate electrode G1 may be formed of the same material, andmay be on the same layer. The outer wire 213 o and the second gateelectrode G2 may be formed of the same material, and may be on the samelayer. In other embodiments, the first gate electrode G1 and parts ofthe inner wire 213 i and the outer wire 213 o may be formed of the samematerial, and may be on the same layer. The second gate electrode G2 andother parts of the inner wire 213 i and the outer wire 213 o may beformed of the same material, and may be on the same layer.

FIG. 18 illustrates a diagram of an equivalent circuit of a pixelincluded in the display apparatus according to an embodiment.

Referring to FIG. 18, a pixel PX may include signal lines 131, 133, 151,153, 155 and 161, a plurality of thin film transistors T1, T2, T3, T4,T5, T6, and T7 connected to the signal lines 131, 133, 151, 153, 155 and161, the storage capacitor Cst, an initialization voltage line 141, adriving voltage line 165, and the organic light-emitting device OLED.

As illustrated in FIG. 18, each pixel PX may include the signal lines131, 133, 151, 153, 155, and 161, the initialization voltage line 141,and the driving voltage line 165. In another embodiment, at least one ofthe signal lines 131, 133, 151, 153, 155, and 161, the initializationvoltage line 141, and/or the driving voltage line 165 may be shared withpixels adjacent to one another.

Each pixel PX may include a driving thin film transistor T1, a switchingthin film transistor T2, a compensation transistor T3, a firstinitialization thin film transistor T4, an operation control thin filmtransistor T5, an emission control thin film transistor T6, and a secondinitialization thin film transistor T7.

FIG. 18 illustrates that the compensation thin film transistor T3, thefirst initialization thin film transistor T4, and the secondinitialization thin film transistor T7 may be n-channel MOSFET (NMOS),and the other thin film transistors T1, T2, T5, and T6 may be p-channelMOSFET (PMOS). In some embodiment, among the plurality of thin filmtransistors T1, T2, T3, T4, T5, T6, and T7, only one thin filmtransistor may be NMOS and the other thin film transistors may be PMOS.In another embodiment, all of the plurality of thin film transistors T1,T2, T3, T4, T5, T6, and T7 may be NMOS.

A first scan line 131 may supply a first scan signal Sm. A second scanline 153 may supply a second scan signal Sn′ to the second gateelectrode G3 of the compensation transistor T3. A previous scan line 151may supply a previous scan signal Sn−1 to the first initialization thinfilm transistor T4. An emission control line 133 may supply an emissioncontrol signal En to the operation control thin film transistor T5 andthe emission control thin film transistor T6. A following scan line 155may supply a following scan signal Sn+1 to the second initializationthin film transistor T7. A data line 161 crossing the first scan line131 may supply a data signal Dm to the operation control drain electrodeD5 of the operation control thin film transistor T5 through theswitching thin film transistor T2.

The driving voltage line 165 may supply the driving voltage ELVDD to thedriving thin film transistor T1. The initialization voltage line 141 maysupply an initialization voltage Vint, which initializes the pixelelectrode 310, to the first thin film transistor T1.

The gate electrode G1 of the driving thin film transistor T1 may beconnected to the lower electrode C1 of the storage capacitor Cst. Adriving source electrode S1 of the driving thin film transistor T1 maybe connected to the driving voltage line 152 via the operation controlthin film transistor T5. A driving drain electrode D1 of the drivingthin film transistor T1 may be electrically connected to a pixelelectrode of the organic light-emitting device OLED via the emissioncontrol thin film transistor T6. The driving thin film transistor T1 mayreceive a data signal DM according to a switching operation of theswitching thin film transistor T2, and may provide a driving currentI_(OLED) to the organic light-emitting device OLED.

A switching gate electrode G2 of the switching thin film transistor T2may be connected to the first scan line 131. A switching sourceelectrode S2 of the switching thin film transistor T2 may be connectedto a data line 161. A switching drain electrode D2 of the switching thinfilm transistor T2, which is connected to the driving source electrodeS1 of the driving thin film transistor T1, may be connected to thedriving voltage line 152 via the operation control thin film transistorT5. The switching thin film transistor T2 may be turned on in responseto a first scan signal Sm received from the first scan line 131, and mayperform a switching operation to deliver a data signal Dm, which isreceived from the data line 161, to the driving source electrode S1 ofthe driving thin film transistor T1.

A compensation gate electrode G3 of the compensation thin filmtransistor T3 may be connected to the second scan line 153. Acompensation drain electrode D3 of the compensation thin film transistorT3, which is connected to the driving drain electrode D1 of the drivingthin film transistor T1, may be connected to the pixel electrode of theorganic light-emitting device OLED via the emission control thin filmtransistor T6. A compensation source electrode S3 of the compensationthin film transistor T3 may be connected to the lower electrode C1 ofthe storage capacitor Cst, a first initialization drain electrode D4 ofthe first initialization thin film transistor T4, and a driving gateelectrode G1 of the driving thin film transistor T1. The compensationthin film transistor T3 may be turned on in response to the second scansignal Sn′ received through the second scan line 153, and mayelectrically connect the driving gate electrode G1 and the driving drainelectrode D1 of the driving thin film transistor, thereby performingdiode-connection on the driving thin film transistor T1.

A first initialization gate electrode G4 of the first initializationthin film transistor T4 may be connected to the previous scan line 151.A first initialization source electrode S4 of the first initializationthin film transistor T4 may be connected to a second initializationsource electrode S7 of the second initialization thin film transistor T7and the initialization voltage line 141. A first initialization drainelectrode D4 of the first initialization thin film transistor T4 may beconnected to the lower electrode C1 of the storage capacitor Cst, thecompensation source electrode S3 of the compensation thin filmtransistor T3, and the driving gate electrode G1 of the driving thinfilm transistor T1. The first initialization thin film transistor T4 maybe turned on in response to a previous scan signal Sn−1 received fromthe previous scan line 151, and may initialize a voltage of the drivinggate electrode G1 of the driving thin film transistor T1 by supplying aninitialization voltage Vint thereto.

The operation control gate electrode G5 of the operation control thinfilm transistor T5 may be connected to the emission control line 133, anoperation control source electrode S5 of the operation control thin filmtransistor T5 may be connected to the driving voltage line 165, and anoperation control drain electrode D5 of the operation control thin filmtransistor T5 may be connected to the driving source electrode T1 of thedriving thin film transistor T1 and the switching drain electrode D2 ofthe switching thin film transistor T2.

An emission control gate electrode G6 of the emission control thin filmtransistor T6 may be connected to the emission control line 133, anemission control source electrode S6 of the emission control thin filmtransistor T6 may be connected to the driving drain electrode D1 of thedriving thin film transistor T1 and the compensation drain electrode D3of the compensation thin film transistor T3, and an emission controldrain electrode D6 of the emission control thin film transistor T6 maybe electrically connected to a second initialization drain electrode D7of the second initialization thin film transistor T7 and the pixelelectrode of the organic light-emitting device OLED.

The operation control thin film transistor T5 and the emission controlthin film transistor T6 may be simultaneously turned on in response tothe emission control signal En received from the emission control line133, and may transmit the driving voltage ELVDD to the organiclight-emitting device OLED such that the driving current I_(OLED) mayflow through the organic light-emitting device OLED.

A second initialization gate electrode G7 of the second initializationthin film transistor T7 may be connected to the following scan line 155,the second initialization drain electrode D7 of the secondinitialization thin film transistor T7 may be connected to the emissioncontrol drain electrode D6 of the emission control thin film transistorT6 and the pixel electrode 310 of the organic light-emitting deviceOLED, and the second initialization source electrode S7 of the secondinitialization thin film transistor T7 may be connected to the firstinitialization source electrode S4 and the initialization voltage line141 of the first initialization thin film transistor T4. The secondinitialization thin film transistor T7 may be turned on in response tothe following scan signal Sn+1 received from the following scan line155, and may initialize the pixel electrode 310 of the organiclight-emitting device OLED.

As illustrated in FIG. 18, the second initialization thin filmtransistor T7 may be connected to the following scan line 155. Inanother embodiment, the second initialization thin film transistor T7may be connected to the emission control line 133, and may be driven inresponse to the emission control signal En. Meanwhile, positions of thesource electrode S1 through S7 and the drain electrodes D1 through D4 ofFIG. 2 may be changed according to whether the transistor is a p-typetransistor or an n-type transistor.

FIG. 19 illustrates a layout view of positions of a plurality of thinfilm transistors and a storage capacitor arranged in a pixel included inthe display apparatus, according to an embodiment.

Referring to FIG. 19, a pixel in the display apparatus according to anembodiment may include the first scan line 131, the second scan line153, the previous scan line 151, the following scan line 155, theemission control line 133, and the initialization voltage line 141 thatextend in a first direction, and the data line 161 and the drivingvoltage line 165 extending in a second direction to cross the first scanline 131, the second scan line 153, the previous scan line 151, thefollowing scan line 155, the emission control line 133, and theinitialization voltage line 141. In the embodiment, the data line 161may be two wires that are provided in one pixel and are separated fromeach other. In another embodiment, the data line 161 may be a singlewire included in each pixel.

The pixel may include the driving thin film transistor T1, the switchingthin film transistor T2, the compensation thin film transistor T3, thefirst initialization thin film transistor T4, the operation control thinfilm transistor T5, the emission control thin film transistor T6, thesecond initialization thin film transistor T7, and the storage capacitorCst.

In the embodiment, the driving thin film transistor T1, the switchingthin film transistor T2, the operation control thin film transistor T5,and the emission control thin film transistor T6 may be thin filmtransistors respectively including silicon semiconductors.

The compensation thin film transistor T3, the first initialization thinfilm transistor T4, and the second initialization thin film transistorT7 may be thin film transistors respectively including oxidesemiconductors.

Semiconductor layers of the driving thin film transistor T1, theswitching thin film transistor T2, the operation control thin filmtransistor T5, and the emission control thin film transistor T6 may beplaced on one same layer, and may include same materials. For example,the semiconductor layers may be formed of, e.g., polycrystallinesilicon.

The semiconductor layers of the driving thin film transistor T1, theswitching thin film transistor T2, the operation control thin filmtransistor T5, and the emission control thin film transistor T6 may bearranged on the buffer layer 111 (as illustrated in FIG. 2) that isarranged on the substrate 110.

The semiconductor layers of the driving thin film transistor T1, theswitching thin film transistor T2, the operation control thin filmtransistor T5, and the emission control thin film transistor T6 may beconnected to one another, and may be curved or bent in various forms.

A channel area, a source area, and a drain area may be included in eachof the semiconductor layers of the first thin film transistor T1, theswitching thin film transistor T2, the operation control thin filmtransistor T5, and the emission control thin film transistor T6. Thesource area and the drain area may be at two opposite side of thechannel area. For example, the source area and the drain area may bedoped with impurities, e.g., n-type impurities or p-type impurities. Thesource area and the drain area respectively connected to the sourceelectrode and the drain electrode. Hereinafter, the terms “sourceelectrode” and “drain electrode” are respectively referred to as theterms “source area” and “drain area”.

The driving thin film transistor T1 may include a driving semiconductorlayer and a driving gate electrode. As the driving semiconductor layermay have a curved form, a driving channel area may be formed to belonger than each of other channel areas of other thin film transistors.For example, as the driving semiconductor layer may have a form as beingcurved/bent several times, e.g., an omega or the alphabet “S”, thedriving channel area of the driving thin film transistor T1 may have agreat length in a narrow area. As the driving channel area may have thegreat length, a driving range of a gate voltage applied to the drivinggate electrode may be increased. Thus, a gradation of light emitted fromthe organic light-emitting device OLED may be more elaboratelycontrolled, and the display quality may be increased. The driving gateelectrode, which is formed in an island type, may overlap the drivingchannel area with the first gate insulating layer 112 (in, e.g., FIG. 2)therebetween.

The storage capacitor Cst may be arranged to overlap the driving thinfilm transistor T1. The storage capacitor Cst may include the lowerelectrode C1 and the upper electrode C2. The driving gate electrode mayfunction not only as the gate electrode of the driving thin filmtransistor but also as the lower electrode C of the storage capacitorCst. In other words, the driving gate electrode and the lower electrodeC1 may be integrated each other. The upper electrode C2 of the storagecapacitor Cst may be arranged to overlap the lower electrode C1 of thestorage capacitor Cst with the second gate insulating layer 113 (in,e.g., FIG. 2) therebetween.

The switching thin film transistor T2 may include a switchingsemiconductor layer and a switching gate electrode. A side of theswitching semiconductor layer may be connected to the data line 161through a contact hole, and another side of the switching semiconductorlayer may be connected to the driving semiconductor layer. The switchinggate electrode may be arranged as a part of the first scan line 131.

The operation control thin film transistor T5 may include an operationcontrol semiconductor layer and an operation control gate electrode. Aside of the operation control semiconductor layer may be connected tothe driving voltage line 165 through a contact hole, and another side ofthe operation control semiconductor layer may be connected to thedriving semiconductor layer. The operation control gate electrode may bearranged as a part of the emission control line 133.

The emission control thin film transistor T6 may include an emissioncontrol semiconductor layer and a emission control gate electrode. Aside of the emission control semiconductor layer may be connected to thedriving semiconductor layer, and another side of the emission controlsemiconductor layer may be connected to a connection electrode CMthrough a contact hole. The connection electrode CM may be connected tothe pixel electrode 310 (in, e.g., FIG. 2) of the organic light-emittingdevice OLED. The emission control gate electrode may be provided as apart of the emission control line 133.

Semiconductor layers of the compensation thin film transistor T3, thefirst initialization thin film transistor T4, and the secondinitialization thin film transistor T7 may be placed on one same layer,and may include a same material. For example, the semiconductor layersmay include an oxide semiconductor.

Each of the semiconductor layers may include a channel area, a sourcearea, and a drain area. The source area and the drain area may berespectively arranged at two opposite sides of the channel area. Forexample, the source area and the drain area may be areas respectivelyhaving carrier concentrations increased due to a plasma treatment. Thesource area and the drain area may be respectively connected to thesource electrode and the drain electrode. Hereinafter, the terms “sourceelectrode” and “drain electrode” are respectively referred to as theterms “source area” and “drain area”.

The compensation thin film transistor T3 may include a compensationsemiconductor layer including an oxide semiconductor and a compensationgate electrode. A side of the compensation semiconductor layer may bebridge-connected to the driving gate electrode through a node connectionline 166. The compensation semiconductor layer may be connected to afirst initialization semiconductor layer. Another side of thecompensation semiconductor layer may be connected to the drivingsemiconductor layer and the emission control semiconductor layer. Thecompensation gate electrode may be provided as a part of the second scanline 153.

The first initialization thin film transistor T4 may include the firstinitialization semiconductor layer including an oxide semiconductor anda first initialization gate electrode. A side of the firstinitialization semiconductor layer may be connected to theinitialization voltage line 141, and another side of the firstinitialization semiconductor layer may be bridge-connected to thedriving gate electrode through the node connection line 166. The firstinitialization gate electrode may be provided as a part of the previousscan line 151.

The second initialization thin film transistor T7 may include a secondinitialization semiconductor layer and the first initialization gateelectrode. A side of the second initialization semiconductor layer maybe connected to the initialization voltage line 141, and another side ofthe second initialization semiconductor layer may be connected to theemission control semiconductor layer through the third contact holeCNT3. A second initialization gate electrode may be provided as a partof the following scan line 155.

The third gate insulating layer 115 (in, e.g., FIG. 2) corresponding toeach channel area may be placed between the compensation semiconductorlayer and the compensation gate electrode, between the firstinitialization semiconductor layer and the first initialization gateelectrode, and between the second initialization semiconductor layer andthe second initialization gate electrode.

The interlayer insulating layer 116 (in, e.g., FIG. 2) may be arrangedon the thin film transistors T3, T4, and T7 respectively including theoxide semiconductors, and the data line and the driving voltage line 165may be arranged on an upper area of the interlayer insulating layer 116(in, e.g., FIG. 2).

In the embodiment, the initialization voltage line 141 and the oxidesemiconductor layers may be provided on the same layer, and may beformed of the same material. In another embodiment, the initializationvoltage line 141 and the driving gate electrode may be arranged on thesame layer. In some embodiment, the initialization voltage line 141 andthe upper electrode C2 of the storage capacitor Cst may be provided onthe same layer, and may be formed of the same material.

In an embodiment, the first scan line 131 and the emission control line133 may be formed of the same material, and may be formed on a samelayer. The driving gate electrode, and the data line 163, the drivingvoltage line 165, the node connection line 166, and the connectionelectrode 167 may be formed of the same material, and may be formed on asame layer as one another.

The display apparatuses 10, 20, 30, 40, 50, and 60 according to theembodiments may respectively include the first thin film transistors T1including the silicon semiconductors and the second thin filmtransistors T2 including the oxide semiconductors. Thus, powerconsumptions of the display apparatuses 10, 20, 30, 40, and 50 may bedecreased, and may have high quality.

In addition, the display apparatuses 10, 20, 30, 40, 50, and 60according to the embodiments may respectively include the storagecapacitors Cst at least partially overlapping the first thin filmtransistor T1. As the second semiconductor layer AO2 of the second thinfilm transistor and one of the electrodes of the storage capacitor Cstmay be placed on the same layer, the process time and the process costfor the display apparatuses 10, 20, 30, 40, 50, and 60 may be reduced,and the display apparatuses 10, 20, 30, 40, and 50 may have highintegration densities.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in forms and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims.Therefore, the scope of the present disclosure is defined not by thedetailed description of the present disclosure but by the appendedclaims.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A display apparatus comprising: a substrateincluding a display area; a first thin film transistor arranged on thedisplay area of the substrate, the first thin film transistor having afirst semiconductor layer including a silicon semiconductor and a firstgate electrode insulated from the first semiconductor layer by a firstgate insulating layer; a second thin film transistor arranged on thedisplay area of the substrate, the second thin film transistor having asecond semiconductor layer including an oxide semiconductor and a secondgate electrode insulated from the second semiconductor layer; and astorage capacitor at least partially overlapping the first thin filmtransistor, the storage capacitor having a lower electrode and an upperelectrode, wherein the second semiconductor layer and one of the lowerelectrode and the upper electrode are arranged on a same layer.
 2. Thedisplay apparatus as claimed in claim 1, further comprising a secondgate insulating layer arranged between the first gate electrode and thesecond semiconductor layer, wherein: the lower electrode of the storagecapacitor and the first gate electrode of the first thin film transistorare formed in one same body, and the upper electrode of the storagecapacitor is arranged on the second gate insulating layer.
 3. Thedisplay apparatus as claimed in claim 1, wherein: the secondsemiconductor layer of the second thin film transistor includes a secondchannel area, a second source area, and a second drain area, the secondsource area and the second drain area respectively arranged at twoopposite sides of the second channel area, and the upper electrode ofthe storage capacitor and at least one of the second source area and thesecond drain area include a same material.
 4. The display apparatus asclaimed in claim 1, further comprising a display device driven by thefirst thin film transistor and the second thin film transistor, whereinthe first thin film transistor includes a driving thin film transistorto supply a driving current to the display device.
 5. The displayapparatus as claimed in claim 1, further comprising a first wire in thedisplay area, wherein the first wire and the upper electrode of thestorage capacitor are arranged on a same layer, and include a samematerial.
 6. The display apparatus as claimed in claim 1, furthercomprising a second wire in the display area, wherein the second wireand the first gate electrode are arranged on a same layer and include asame material.
 7. The display apparatus as claimed in claim 1, furthercomprising: a second gate insulating layer arranged between the firstgate electrode and the second semiconductor layer; and a third gateinsulating layer arranged between the second semiconductor layer and thesecond gate electrode, wherein: the lower electrode of the storagecapacitor and the second semiconductor layer are arranged on a samelayer; a dielectric layer of the storage capacitor and the third gateinsulating layer are formed of a same material; and the upper electrodeof the storage capacitor and the second gate electrode of the secondthin film transistor are arranged on a same layer as.
 8. The displayapparatus as claimed in claim 1, further comprising an interlayerinsulating layer arranged on the second gate electrode; a firstelectrode arranged on the interlayer insulating layer and connected tothe first semiconductor layer through a contact hole defined in theinterlayer insulating layer; a planarization layer arranged on the firstelectrode; a connection electrode arranged on the planarization layerand connected to the first electrode through a contact hole defined inthe planarization layer; and an upper planarization layer arranged onthe connection electrode.
 9. The display apparatus as claimed in claim8, further comprising an organic light-emitting device arranged on theupper planarization layer, the organic light-emitting device including apixel electrode, an intermediate layer comprising an organic emissionlayer, and an opposite electrode.
 10. A display apparatus comprising: asubstrate including a first area, a second area, and a bending areabetween the first area and the second area, the bending area bent withrespect to a bending axis; a first thin film transistor, a second thinfilm transistor, and a storage capacitor arranged in the first area ofthe substrate; a connection wire extending from the first area to thesecond area across the bending area; and an inner wire and an outer wirerespectively connected to the connection wire, the inner wire and theouter wire spaced apart from each other by the bending area, wherein:the first thin film transistor has a first semiconductor layer includinga silicon semiconductor and a first gate electrode insulated from thefirst semiconductor layer by a first gate insulating layer, the secondthin film transistor has a second semiconductor layer including an oxidesemiconductor layer and a second gate electrode insulated from thesecond semiconductor layer by a third gate insulating layer, and thesecond semiconductor layer and one of a lower electrode and an upperelectrode of the storage capacitor are arranged on a same layer.
 11. Thedisplay apparatus as claimed in claim 10, further comprising a displaydevice driven by the first thin film transistor and the second thin filmtransistor, wherein the first thin film transistor includes a drivingthin film transistor to supply a driving current to the display device.12. The display apparatus as claimed in claim 10, wherein the storagecapacitor at least partially overlaps the first thin film transistor.13. The display apparatus as claimed in claim 10, further comprising asecond gate insulating layer arranged between the first gate electrodeof the first thin film transistor and the second semiconductor layer,wherein: the lower electrode of the storage capacitor and the first gateelectrode of the first thin film transistor are formed in one body, andthe upper electrode of the storage capacitor is arranged on the secondgate insulating layer.
 14. The display apparatus as claimed in claim 10,wherein parts of the inner wire and the outer wire are arranged on asame layer, and wherein the inner wire, the outer wire, and the firstgate electrode include a same material.
 15. The display apparatus asclaimed in claim 10, wherein parts of the inner wire and the outer wireare arranged on a same layer, and wherein the inner wire, the outerwire, and the second gate electrode include a same material.
 16. Thedisplay apparatus as claimed in claim 15, further comprising a thirdgate insulating layer between the second semiconductor layer and thesecond gate electrode, wherein: the third gate insulating layer isarranged below the inner wire, and a width of the third gate insulatinglayer arranged below the inner wire is substantially identical to awidth of the inner wire.
 17. The display apparatus as claimed in claim10, further comprising an interlayer insulating layer arranged on thesubstrate and covering the second gate electrode; a first electrodearranged on the interlayer insulating layer and connected to the firstsemiconductor layer; and a planarization layer covering the firstelectrode.
 18. The display apparatus as claimed in claim 17, furthercomprising an organic material layer arranged between the substrate andthe connection wire in the bending area, wherein the organic materiallayer and the planarization layer include a same material.
 19. Thedisplay apparatus as claimed in claim 18, further comprising aconnection electrode arranged on the planarization layer and connectedto the first electrode via contact holes defined in the planarizationlayer, wherein the connection wire and the connection electrode includea same material.
 20. The display apparatus as claimed in claim 18,further comprising an inorganic insulating layer including an opening ora groove corresponding to the bending area, wherein the organic materiallayer fills the opening or the groove of the inorganic insulating layer.